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Thalmeier, R.*; 谷田 聖; 他97名*
Nuclear Instruments and Methods in Physics Research A, 845, p.633 - 638, 2017/02
被引用回数：6 パーセンタイル：51.46(Instruments & Instrumentation)The Belle II Experiment at the High Energy Accelerator Research Organization (KEK) in Tsukuba, Japan, will explore the asymmetry between matter and antimatter and search for new physics beyond the standard model. 172 double-sided silicon strip detectors are arranged cylindrically in four layers around the collision point to be part of a system which measures the tracks of the collision products of electrons and positrons. A total of 1748 radiation-hard APV25 chips read out 128 silicon strips each and send the analog signals by time-division multiplexing out of the radiation zone to 48 Flash Analog Digital Converter Modules (FADC). Each of them applies processing to the data; for example, it uses a digital finite impulse response filter to compensate line signal distortions, and it extracts the peak timing and amplitude from a set of several data points for each hit, using a neural network. We present an overview of the SVD data readout system, along with front-end electronics, cabling, power supplies and data processing.
Adamczyk, K.*; 谷田 聖; Belle-II SVD Collaboration*; 他97名*
Nuclear Instruments and Methods in Physics Research A, 845, p.38 - 42, 2017/02
被引用回数：0 パーセンタイル：0.02(Instruments & Instrumentation)The Belle II experiment at the asymmetric SuperKEKB collider in Japan will operate at an instantaneous luminosity approximately 50 times greater than its predecessor (Belle). The central feature of the experiment is a vertex detector comprising two layers of pixelated silicon detectors (PXD) and four layers of double-sided silicon microstrip detectors (SVD). One of the key measurements for Belle II is CP violation asymmetry in the decays of beauty and charm hadrons, which hinges on a precise charged-track vertex determination and low-momentum track measurement. Towards this goal, a proper assembly of the SVD components with precise alignment ought to be performed and the geometrical tolerances should be checked to fall within the design limits. We present an overview of the assembly procedure that is being followed, which includes the precision gluing of the SVD module components, wire-bonding of the various electrical components, and precision 3D coordinate measurements of the final SVD modules.
Kang, K. H.*; 谷田 聖; Belle-II SVD Collaboration*; 他94名*
Nuclear Instruments and Methods in Physics Research A, 831, p.213 - 220, 2016/09
被引用回数：0 パーセンタイル：0.02(Instruments & Instrumentation)A silicon vertex detector (SVD) for the Belle-II experiment comprises four layers of double-sided silicon strip detectors (DSSDs), assembled in a ladder-like structure. Each ladder module of the outermost SVD layer has four rectangular and one trapezoidal DSSDs supported by two carbon-fiber ribs. In order to achieve a good signal-to-noise ratio and minimize material budget, a novel chip-on-sensor "Origami" method has been employed for the three rectangular sensors that are sandwiched between the backward rectangular and forward (slanted) trapezoidal sensors. This paper describes the bonding procedures developed for making electrical connections between sensors and signal fan-out flex circuits (i.e., pitch adapters), and between pitch adapters and readout chips as well as the results in terms of the achieved bonding quality and pull force.
Adamczyk, K.*; 谷田 聖; 他94名*
Nuclear Instruments and Methods in Physics Research A, 824, p.381 - 383, 2016/07
被引用回数：0 パーセンタイル：0.02(Instruments & Instrumentation)The Belle II experiment at the SuperKEKB asymmetric 
collider in Japan will operate at a luminosity approximately 50 times larger than its predecessor (Belle). At its heart lies a six-layer vertex detector comprising two layers of pixelated silicon detectors (PXD) and four layers of double-sided silicon microstrip detectors (SVD). One of the key measurements for Belle II is time-dependent CP violation asymmetry, which hinges on a precise charged-track vertex determination. Towards this goal, a proper assembly of the SVD components with precise alignment ought to be performed and the geometrical tolerances should be checked to fall within the design limits. We present an overview of the assembly procedure that is being followed, which includes the precision gluing of the SVD module components, wire-bonding of the various electrical components, and precision three dimensional coordinate measurements of the jigs used in assembly as well as of the final SVD modules.
Adamczyk, K.*; 谷田 聖; 他94名*
Nuclear Instruments and Methods in Physics Research A, 824, p.406 - 410, 2016/07
被引用回数：6 パーセンタイル：49.29(Instruments & Instrumentation)The silicon vertex detector of the Belle II experiment, structured in a lantern shape, consists of four layers of ladders, fabricated from two to five silicon sensors. The APV25 readout ASIC chips are mounted on one side of the ladder to minimize the signal path for reducing the capacitive noise; signals from the sensor backside are transmitted to the chip by bent flexible fan-out circuits. The ladder is assembled using several dedicated jigs. Sensor motion on the jig is minimized by vacuum chucking. The gluing procedure provides such a rigid foundation that later leads to the desired wire bonding performance. The full ladder with electrically functional sensors is consistently completed with a fully developed assembly procedure, and its sensor offsets from the design values are found to be less than 200 
m. The potential functionality of the ladder is also demonstrated by the radioactive source test.
Adamczyk, K.*; 谷田 聖; 他94名*
Nuclear Instruments and Methods in Physics Research A, 824, p.480 - 482, 2016/07
被引用回数：1 パーセンタイル：11.14(Instruments & Instrumentation)The Belle-II VerteX Detector (VXD) has been designed to improve the performances with respect to Belle and to cope with an unprecedented luminosity of 8
10
cm
s
achievable by the SuperKEKB. Special care is needed to monitor both the radiation dose accumulated throughout the life of the experiment and the instantaneous radiation rate, in order to be able to promptly react to sudden spikes for the purpose of protecting the detectors. A radiation monitoring and beam abort system based on single-crystal diamond sensors is now under an active development for the VXD. The sensors will be placed in several key positions in the vicinity of the interaction region. The severe space limitations require a challenging remote readout of the sensors.
Thalmeier, R.*; 谷田 聖; 他102名*
Journal of Instrumentation (Internet), 11(1), p.C01044_1 - C01044_10, 2016/01
被引用回数：2 パーセンタイル：11.13(Instruments & Instrumentation)The upgrade of the Belle II experiment plans to use a vertex detector based on two different technologies, DEPFET pixel (PXD) technology and double side silicon microstrip (SVD) technology. The vertex electronics are characterized by the topology of SVD bias that forces to design a sophisticated grounding because of the floating power scheme. The complex topology of the PXD power cable bundle may introduce some noise inside the vertex area. This paper presents a general overview of the EMC issues present in the vertex system, based on EMC tests on an SVD prototype and a study of noise propagation in the PXD cable bundle based on Multi-conductor transmission line theory.
